Dell EMC VxFlex Ready Node R740xd Gebruikershandleiding - Pagina 31
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Expanded operating temperature restrictions
The following additional restrictions apply:
Do not perform a cold startup below 5°C.
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The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
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150 W/8 core, 165 W/12 core and higher wattage processor [Thermal Design Power (TDP)>165 W] are not
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supported.
Redundant power supply unit is required.
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Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
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PCIe SSD is not supported.
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DCPMMs are not supported.
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Mid drive tray is only supported on VxFlex Ready Node.
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Tape backup unit is not supported.
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Ambient temperature limitations
The following table lists configurations that require ambient temperature of less than 35°C.
Note:
The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess processor
throttling, which may impact system performance.
Table 25 Configuration based ambient temperature restrictions
System
Backplane
R740xd
24 x 2.5 inch
SAS/SATA
24 x 2.5 inch
SAS/SATA + 4 x
2.5 inch + 4 x 2.5
inch
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulate and
gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in
equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental
conditions is the responsibility of the customer.
Processor
Processor heat
Thermal Design
sink
Power (TDP)
150 W/8 core,
1U high performance High
165 W/12 core,
performance fan
200 W, 205 W
150 W/8 core,
High performance fan
165 W/12 core,
200 W, 205 W
Fan type
GPU
≥1 double-
width/single-
width
NA
R740xd Owner's Guide
Technical specifications
Ambient
restriction
30°C
25°C
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