Sony Walkman MZ-R900 Servicehandleiding - Pagina 3

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NOTES ON HANDLING THE OPTICAL PICK-UP

BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electro-

static break-down because of the potential difference generated

by the charged electrostatic load, etc. on clothing and the human

body.

During repair, pay attention to electrostatic break-down and also

use the procedure in the printed matter which is included in the

repair parts.

The flexible board is easily damaged and should be handled with

care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when

checking it for adjustment. It is feared that you will lose your sight.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK

(LCX-4R)

The laser diode in the optical pick-up block may suffer electro-

static break-down easily. When handling it, perform soldering

bridge to the laser-tap on the flexible board. Also perform mea-

sures against electrostatic break-down sufficiently before the op-

eration. The flexible board is easily damaged and should be handled

with care.

laser-tap

OPTICAL PICK-UP FLEXIBLE BOARD

CAUTION

Use of controls or adjustments or performance of procedures

other than those specified herein may result in hazardous ra-

diation exposure.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

SECTION 1

SERVICING NOTES

• In performing the repair with the power supplied to the set,

removing the MAIN board causes the set to be disabled.

In such a case, fix a convex part of the open/close detect switch

(S806 on MAIN board) with a tape in advance.

Handle the FLEXIBLE board (overwrite head) with care, as it

has been soldered directly to the MAIN board.

In repairing the component side of MAIN board, connect the

FLEXIBLE board (overwrite head) and the MAIN board with

the lead wires in advance. (See page 7)

• Replacement of CDX2671-203GA (IC801) used in this set

requires a special tool.

• On the set having the microcomputer version 1.000, some

adjusted values were set in the manual mode at the shipment,

but these data will be cleared when the NV is reset. Therefore,

on the set having the microcomputer version 1.000, change the

adjusted values following the Change of Adjusted Values

immediately after the NV was reset. (See page 17)

• If the nonvolatile memory was replaced on the set, the modified

program data must be written to the nonvolatile memory. In such

a case, write the modified data that meets the microcomputer

version following the patch data rewriting procedure at the

replacement of nonvolatile memory. (See page 22)

FLEXIBLE board

(Over write head)

Tape

S806

MZ-R900

upper panel assy

MAIN board