CYNTEC TFP-21-S-148-A Handmatig - Pagina 5

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CYNTEC CO., LTD.
乾坤科技股份有限公司
乾坤科技股份有限公司
乾坤科技股份有限公司
乾坤科技股份有限公司
7. Life Test
Item
Resistance to
Electrical characteristics shall be
Soldering Heat
within specification
(Dipping)
Without distinct damage in appearance
Resistance to
Electrical characteristics shall be
Soldering Heat
within specification
(Reflow)
Without distinct damage in appearance
Rapid change of
Electrical characteristics shall be
Temperature
within specification
Without distinct damage in appearance
Moisture with
Electrical characteristics shall be
Load
within specification
Without distinct damage in appearance
Low Temperature
Electrical characteristics shall be
Load Life
within specification
Without distinct damage in appearance
High Temperature
Electrical characteristics shall be
Load Life
within specification
Without distinct damage in appearance
Specification
DOCUMENT : RFB00000
REVISION
PAGE
Condition
Immerse the chip in the solder of 270
for 10 0.5 seconds after preheating for 1
min. at 120 to 150℃.
Temp.
240℃
220℃
150 10℃
60 ~ 120sec.
(1) Repeat 100 cycle as follows :
(-40 3℃,30minutes)
(Room temperature, 2~3 minutes)
(+85 2℃,30minutes)
(Room temperature, 2~3 minutes)
(2) Measuring resistance 1 hour after test
(1) Environment condition :
40
2℃, 90 ~ 95% RH
(2) Load : 630mA current
(3) Test period : (1.5 hour ON)
(0.5 hour OFF) cycled for
total 1,000 + 48 / - 0 hours
:
(1) Store temperature
for total 1000+48/-0hr
(2) Load : 630mA current
(1) Store temperature : +85 2℃
for total 1000+48/-0hr
(2) Load : 630mA current
: A0
: 5 OF 11
5℃
20 ~ 40sec.
Time
-40 2℃