Cypress CY62158EV30 Specificatieblad - Pagina 4

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Cypress CY62158EV30 Specificatieblad
Thermal Resistance
[9]
Parameter
Description
Θ
Thermal Resistance
JA
(Junction to Ambient)
Θ
Thermal Resistance
JC
(Junction to Case)
AC Test Loads and Waveforms
R1
V
CC
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
Parameters
R1
R2
R
TH
V
TH
Data Retention Characteristics
Parameter
Description
V
V
for Data Retention
DR
CC
[8]
I
Data Retention Current
CCDR
[9]
t
Chip Deselect to Data
CDR
Retention Time
[10]
t
Operation Recovery
R
Time
Data Retention Waveform
V
CC
CE
1
or
CE
2
Note
10. Full Device AC operation requires linear V
Document #: 38-05578 Rev. *D
Test Conditions
Still Air, soldered on a 3 x 4.5 inch,
two-layer printed circuit board
V
CC
GND
R2
Rise Time: 1 V/ns
Equivalent to:
2.5V
16667
15385
8000
1.20
(Over the Operating Range)
Conditions
V
= 1.5V, CE
> V
CC
1
or CE
< 0.2V, V
2
IN
or V
< 0.2V
IN
DATA RETENTION MODE
V
, min
CC
t
CDR
> 100 µs or stable at V
ramp from V
to V
CC
DR
CC(min)
CY62158EV30 MoBL
BGA
72
8.86
ALL INPUT PULSES
90%
10%
THÉ VENIN EQUIVALENT
R
TH
OUTPUT
3.0V
1103
1554
645
1.75
Min
1.5
− 0.2V
CC
− 0.2V
> V
CC
0
t
RC
> 1.5V
V
DR
> 100 µs.
CC(min)
TSOP II
Unit
°C/W
76.88
°C/W
13.52
90%
10%
Fall time: 1 V/ns
V
TH
Unit
Ω
Ω
Ω
V
[4]
Typ
Max
Unit
V
µA
2
5
ns
ns
V
, min
CC
t
R
Page 4 of 11
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