Casio TK-7000 Instrukcja rozwiązywania problemów - Strona 16
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3-3. Solder IC
1) Much solder is soldered to all pins of IC.
2) Solder iron is slid in the left end from the
right edge of IC like above photograph.
At this time, top of the solder iron is the
condition which only the solder is touching
and part from the pin. ( See "[ Fig ]" )
3) Most of the solder can cause to migrate it
to the left end of IC by the above work "2)".
4) Solder is removed, by raising the top of
the solder iron in a slanting direction.
5) "2)" to "4)" of work are repeated.
After that become above photograph.
6) In the case that a little of solder remains,
remove it by using the desoldering
equipment.
7) If removed solder too much with above
work "6)", solder a little of solder again.
8) Above works to other 3 places.
Note : If stickiness appears and also
solder changes color, please add new
solder. It is easy to remove solder.
[ Fig ]
Solder
I C
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Trouble shooting ECR V1.01
Solder iron
Gap
IC-Pin