Dell UP3221Qb Uproszczona instrukcja serwisowa - Strona 14

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3. Assembly SOP

Preparation before assemble
1. Clean the room for work
2. Identify the area for material
3. Prepare the implement, equipment, material as bellow:
1) Working table
2) Screw-driver
3) Glove
4) Cleaning cloth
ESD protection
Item
1
Picture
Operation
1. Insert "TBT BD FFC" and
"EDP wire" into I/F BD
2. Adhere a tape to fix EDP wire
on I/F BD (See Yellow mark)
3. Assemble I/F BD to "ASSY
BKT PLATE" and lock 2 Bolts
(See Orange mark) and 2
PCBA screws (See Red mark)
to fix I/F BD
4. Assemble "Spacer" on I/F BD
(See Blue mark)
5. Insert "Thermal Sensor FFC"
and "EDP FFC" into I/F BD
(See Pink mark), then, adhere
a tape to fix "EDP FFC" (See
Green mark)
6. Insert "SOC wire" and "SOC
Backlight wire" into I/F BD
7. Paste a yellow tape to fix
"SOC wire" on I/F BD (See
White mark)
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Tools
Notes
Screw-
driver
Torsion of
PCBA
screw:
5.0-5.5 kg
Torsion of
Bolt:
5.0-5.5 kg