Toshiba 13A26C Instrukcja serwisowa - Strona 17

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INSTALLATION

Take care of the polarity of new IC and then install the new

IC fitting on the printed circuit pattern. Then solder each

lead on the diagonal positions of IC temporarily.

(Refer to Fig. 2-5.)

Soldering Iron

Solder temporarily

Supply the solder from the upper position of IC leads

sliding to the lower position of the IC leads.

(Refer to Fig. 2-6.)

Solder

Supply soldering

from upper position

to lower position

Absorb the solder left on the lead using the Braided Shield

Wire. (Refer to Fig. 2-7.)

NOTE

Do not absorb the solder to excess.

Soldering Iron

Braided Shield Wire

DISASSEMBLY INSTRUCTIONS

Solder temporarily

Fig. 2-5

Soldering Iron

Fig. 2-6

Fig. 2-7

B2-2

When bridge-soldering between terminals and/or the

soldering amount are not enough, resolder using a Thin-tip

Soldering Iron. (Refer to Fig. 2-8.)

Thin-tip Soldering Iron

Finally, confirm the soldering status on four sides of the IC

using a magnifying glass.

Confirm that no abnormality is found on the soldering

position and installation position of the parts around the IC.

If some abnormality is found, correct by resoldering.

NOTE

When the IC leads are bent during soldering and/or

repairing, do not repair the bending of leads. If the

bending of leads are repaired, the pattern may be

damaged. So, always be sure to replace the IC in this

case.

Fig. 2-8

13A26/13A26C