DORIC Bundle-imaging Fiber Photometry System Gen3 Manual do utilizador - Página 7
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Imprimir página4.1 General specifications
SPECIFICATION
Bundle-imaging Fluorescence Mini Cube
Wavelength range
Field of view
Objective NA
Optical Fiber connector
Max. number of sites
Excitation Uniformity
Optical fiber compatibility
Optical fiber attenuation
Built-in LEDs
Max Current
Maximum Output Power
Sensor
CMOS image sensor
Pixel Size
Resolution
Quantum Efficiency
Frame Rate
Power consumption (supplied by USB)
DI/O
Number of ports
Maximum sampling rate
Ports description
Table 4.1: General specifications for BFMC Gen3
VALUE
350 to 1100
2.5
0.4
SMA
- 20x core 400 µm NA0.37
- 60x core 200 µm NA0.37
- 100x core 100 µm NA0.37
10% over FOV
Core diameter 100, 200, or 400 µm NA 0.37
OD 5 outside band
500
See Table
4.3
Sony IMX174LLJ
5.86 x 5.86
1024 x 1024
82
at 520nm
up to 60
200
32
10
8 BNC I/O + 1 DB25 (8 Input/Output, 8 Input,
8 Output)
7
4
Specifications
UNIT
nm
mm
-
-
-
-
-
-
mA
-
-
µm
pixels
Hz
mA
-
kSps
-