Dusun DSM-05D Manual do utilizador - Página 9
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Zhejiang Dusun Electron Co., Ltd
6 Production instructions
1. Use an SMT placement machine to mount components to the stamp hole
module that DUSUN produces within 24 hours after the module is unpacked
and the firmware is burned. If not, vacuum packs the module again. Bake the
module before mounting components to the module.
•
SMT placement equipment:
Reflow soldering machine
Automated optical inspection (AOI) equipment
Nozzle with a 6 mm to 8 mm diameter
•
Baking equipment:
Cabinet oven
Anti-static heat-resistant trays
Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
•
The moisture-proof bag is placed in an environment where the temperature is
below 30℃ and the relative humidity is lower than 70%.
•
The shelf life of a dry-packaged product is six months from the date when the
product is packaged and sealed.
•
The package contains a humidity indicator card (HIC).
3. Bake a module based on HIC status as follows when you unpack the module
package:
•
If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
hours.
•
If the 30% circle is pink, bake the module for 4 consecutive hours.
•
If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
•
If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive
hours.
4. Baking settings:
•
Baking temperature: 125±5℃
Zhejiang Dusun Electron Co., Ltd
Tel: 86-571-86769027/8 8810480
Website: www.dusuniot.
Floor 8, Building A, Wantong Center
www.dusunremotes.com
Hangzhou, China
www.dusunlock.com