HP 205 G2 AiO Business Instruções de desmontagem do produto no fim da sua vida útil - Página 2
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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 crisscross screw driver
Description #2 hexagon screw driver
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Take off rear cover
2.
Take off mother board cover
3. Romove all the cables from PCA
4. Take off MB
5. Remove memory from the PCA
6. Remove battery from the PCA
7. Take off speaker from the unit
8. Take off HDD from the unit
9. Take off system fan from the unit
10. Take off convertor board from the unit
11. Take off ODD from the unit
12. Take off button bracket
13. Take off camera from the unit
14. Take off main chassis
15. Take off panel from the unit
16. Open the power adapter by mechanical force.
17.
18.
19.
20.
21.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
Tool Size (if
applicable)
2#
T15
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