Chrontel CH7515A Manual de conceção de layouts - Página 10
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AN-B021
(Panel power, backlight power, pull-up voltage)
• LVDS Power
Close attention must be paid to the power supplied to the LVDS backlight and the LVDS panel. Power requirements
may differ from panel to panel. Please check the panels' power and backlight voltage specifications. BLL_EN,
BLR_EN and VDDEN of the CH7515A can be used as control signal to turn on the power to the LVDS backlight and
the LVDS logic circuitry.
2.10 Thermal Exposed Pad Package
The CH7515A are available in 128-pin TQFP package with thermal exposed pad package. The advantage of the
thermal exposed pad package is that the heat can be dissipated through the ground layer of the PCB more efficiently.
When properly implemented, the exposed pad package provides a means of reducing the thermal resistance of the
CH7515A.
Careful attention to the design of the PCB layout is required for good thermal performance. For maximum heat
dissipation, the exposed pad of the package should be soldered to the PCB as shown in Figure 12.
Die
Exposed Pad
Pin
Solder
PCB
Figure 12: Cross-section of exposed pad package
10
206-1000-021
Rev 1.0
2020-07-15