Sony NEX-F3D Manual de serviço - Página 2
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(ENGLISH)
NOTE:
• -XX, -X mean standardized parts, so they may have some dif-
ferences from the original one.
• Items marked "*" are not stocked since they are seldom required
for routine service. Some delay should be anticipated when
ordering these items.
• The mechanical parts with no reference number in the exploded
views are not supplied.
• Due to standardization, replacements in the parts list may be
different from the parts specified in the diagrams or the com-
ponents used on the set.
• CAPACITORS:
uF: μF
• COILS
uH: μH
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
• SEMICONDUCTORS
In each case, u: μ, for example:
uA...: μA... , uPA... , μPA... ,
uPB... , μPB... , μPC... , μPC... ,
uPD..., μPD...
When indicating parts by reference
number, please include the board name.
The components identified by mark 0 or
dotted line with mark are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant
le numéro spécifié.
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Note:
Be sure to read "Precautions for Replacement of Imager"
on page 6-1.
NEX-F3D/F3K/F3Y_L3
2. REPAIR PARTS LIST
(JAPANESE)
【使用上の注意】
• ここに記載されている部品は, 補修用部品であるため, 回路図
及びセットに付いている部品と異なる場合があります。
• -XX, -Xは標準化部品のため, セットに付いている部品と異な
る場合があります。
• *印の部品は常備在庫しておりません。
• コンデンサの単位でuFはμFを示します。
• 抵抗の単位Ωは省略してあります。
金 被：金属被膜抵抗。
サンキン：酸化金属被膜抵抗。
• インダクタの単位でuHはμHを示します。
• 半導体の名称でuA..., uPA..., uPB..., uPC..., uPD...等はそれぞれ
μA..., μPA..., μPB..., μPC..., μPD...を示します。
お願い
図面番号で部品を指定するときは基板名
又はブロックを併せて指定してください。
0印の部品，または0印付の点線で囲ま
れた部品は，安全性を維持するために，
重要な部品です。
従って交換時は，必ず指定の部品を使用
してください。
注意
電池の交換は， 正しく行わないと破裂する恐れがあります。
電池を交換する場合には必ず同じ型名の電池又は同等品と
交換してください。
使用済み電池は，取扱指示に従って処分してください。
Note:
イメージャの交換時は6-1ページの"イメージャ交換時の
注意"を必ずお読みください。
FP-1583
2-2. ELECTRICAL PARTS LIST
Ref. No.
Part No.
Description
1-886-214-11
FP-1583 FLEXIBLE BOARD
*********************
A-1879-259-A
HM-021 FLEXIBLE BOARD, COMPLETE
******************************
< CONNECTOR >
CN201
1-842-602-11
CONNECTOR, HDMI
A-1886-976-A
CAB F B-ASSY (SERVICE) (BK) (BLACK)
A-1886-977-A
CAB F B-ASSY (SERVICE) (SL) (SILVER)
A-1886-978-A
CAB F B-ASSY (SERVICE) (PI) (PINK)
A-1886-979-A
CAB F B-ASSY (SERVICE) (WH) (WHITE)
(Not supplied)
IS-101 BOARD, COMPLETE
*********************
(All mounted parts and IS-101 COMPLETE BOARD are not supplied, but they are
included in CAB F B-ASSY (SERVICE).)
1-885-294-11
IS-105 FLEXIBLE BOARD
*******************
1-885-295-11
IS-106 FLEXIBLE BOARD
*******************
A-1879-255-A
LC-101 BOARD, COMPLETE
**********************
< CAPACITOR >
C0101
1-112-300-91
CERAMIC CHIP
4.7uF
10%
C0102
1-112-717-91
CERAMIC CHIP
1uF
10%
C0103
1-100-415-91
CERAMIC CHIP
0.47uF
10%
C0104
1-165-908-11
CERAMIC CHIP
1uF
10%
C0105
1-112-746-11
CERAMIC CHIP
4.7uF
10%
C0106
1-112-300-91
CERAMIC CHIP
4.7uF
10%
C0107
1-112-746-11
CERAMIC CHIP
4.7uF
10%
C0108
1-112-021-91
CERAMIC CHIP
2.2uF
20%
C0110
1-112-746-11
CERAMIC CHIP
4.7uF
10%
C0111
1-112-717-91
CERAMIC CHIP
1uF
10%
C0112
1-112-717-91
CERAMIC CHIP
1uF
10%
C0113
1-165-908-11
CERAMIC CHIP
1uF
10%
C0114
1-165-908-11
CERAMIC CHIP
1uF
10%
C0115
1-164-858-11
CERAMIC CHIP
22PF
5%
C0117
1-164-858-11
CERAMIC CHIP
22PF
5%
C0118
1-164-858-11
CERAMIC CHIP
22PF
5%
C0119
1-164-858-11
CERAMIC CHIP
22PF
5%
C0121
1-164-858-11
CERAMIC CHIP
22PF
5%
C0122
1-164-858-11
CERAMIC CHIP
22PF
5%
C0123
1-164-858-11
CERAMIC CHIP
22PF
5%
C0124
1-164-858-11
CERAMIC CHIP
22PF
5%
C0125
1-164-858-11
CERAMIC CHIP
22PF
5%
C0126
1-164-858-11
CERAMIC CHIP
22PF
5%
C0127
1-164-858-11
CERAMIC CHIP
22PF
5%
C0128
1-164-858-11
CERAMIC CHIP
22PF
5%
2-1
HM-021
IS-101
IS-105
IS-106
LC-101
Ref. No.
Part No.
Description
C0129
1-164-858-11
CERAMIC CHIP
C0130
1-164-858-11
CERAMIC CHIP
C0131
1-164-858-11
CERAMIC CHIP
C0132
1-164-858-11
CERAMIC CHIP
C0133
1-164-858-11
CERAMIC CHIP
C0134
1-164-858-11
CERAMIC CHIP
C0135
1-164-858-11
CERAMIC CHIP
C0136
1-164-858-11
CERAMIC CHIP
C0137
1-164-858-11
CERAMIC CHIP
C0138
1-164-858-11
CERAMIC CHIP
C0139
1-164-858-11
CERAMIC CHIP
C0140
1-164-858-11
CERAMIC CHIP
C0141
1-164-858-11
CERAMIC CHIP
C0142
1-164-858-11
CERAMIC CHIP
C0143
1-164-858-11
CERAMIC CHIP
C0144
1-164-858-11
CERAMIC CHIP
< CONNECTOR >
CN0101 1-821-501-11
CONNECTOR, FPC (ZIF) 51P
* CN0103 1-842-522-21
CONNECTOR, FPC (ZIF) 61P
CN0104 1-821-857-51
CONNECTOR, FPC (LIF (NON-ZIF)) 6P
< DIODE >
D0102
6-502-934-01
DIODE DB2S31100K8
< COIL >
* L0101
1-481-642-11
INDUCTOR
< RESISTOR >
R1501
1-218-941-81
METAL CHIP
R1503
1-218-941-81
METAL CHIP
R1505
1-218-941-81
METAL CHIP
R1506
1-218-941-81
METAL CHIP
10V
6.3V
< COMPOSITION CIRCUIT BLOCK >
6.3V
10V
RB0101 1-234-372-11
RES, NETWORK
6.3V
RB0102 1-234-372-11
RES, NETWORK
RB0103 1-234-372-11
RES, NETWORK
10V
RB0104 1-234-372-11
RES, NETWORK
6.3V
RB0105 1-234-372-11
RES, NETWORK
16V
6.3V
RB0106 1-234-372-11
RES, NETWORK
6.3V
6.3V
10V
A-1879-257-A
PR-043 FLEXIBLE BOARD, COMPLETE
10V
******************************
50V
50V
< CAPACITOR >
50V
C001
1-114-582-91
CERAMIC CHIP
50V
50V
< SENSOR >
50V
50V
* SE001
1-487-118-11
GMR SENSOR
50V
50V
50V
A-1879-256-A
RL-132 FLEXIBLE BOARD, COMPLETE
50V
******************************
50V
(BT001 is not included in RL-132 FLEXIBLE COMPLETE BOARD)
PR-043
RL-132
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
22PF
5%
50V
10uH
100
5%
1/16W
100
5%
1/16W
100
5%
1/16W
100
5%
1/16W
100 (1005X4)
100 (1005X4)
100 (1005X4)
100 (1005X4)
100 (1005X4)
100 (1005X4)
0.1uF
10%
16V