Toshiba 21V33E2 Manual de serviço - Página 11

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INSTALLATION

Take care of the polarity of new IC and then install the

new IC fitting on the printed circuit pattern. Then solder

each lead on the diagonal positions of IC temporarily.

(Refer to Fig. 2-5.)

Soldering Iron

Solder temporarily

Supply the solder from the upper position of IC leads

sliding to the lower position of the IC leads.

(Refer to Fig. 2-6.)

Solder

Absorb the solder left on the lead using the Braided

Shield Wire. (Refer to Fig. 2-7.)

NOTE

Do not absorb the solder to excess.

Soldering Iron

Braided Shield Wire

DISASSEMBLY INSTRUCTIONS

Solder temporarily

Soldering Iron

Supply soldering

from upper position

to lower position

When bridge-soldering between terminals and/or the

soldering amount are not enough, resolder using a Thin-

tip Soldering Iron. (Refer to Fig. 2-8.)

Finally, confirm the soldering status on four sides of the

IC using a magnifying glass.

Confirm that no abnormality is found on the soldering

Fig. 2-5

position and installation position of the parts around the

IC. If some abnormality is found, correct by resoldering.

NOTE

When the IC leads are bent during soldering and/or

repairing, do not repair the bending of leads. If the

bending of leads are repaired, the pattern may be

damaged. So, always be sure to replace the IC in this

case.

Fig. 2-6

Fig. 2-7

B2-2

Thin-tip Soldering Iron

Fig. 2-8