MSI MS-S336 Manual do utilizador - Página 7

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System Specifications

Model

Form Factor

Dimensions

Processor

Chipset

Memory

Network

Drive Bays

Internal Storage

Expansion Slots

Security

Server

Management

Cooling

Environmental

Accessory

Power Supply

Certifications

1.71"H (43.5mm) x 17.26"W (438.5mm) x 21.56"D (547.6mm)

∙ 1 x AMD® Ryzen™ 7000 series Processors, TDP 105W

- Processor socket AM5

∙ 4 x DIMM slots

- Supports DDR5, up to 5200MT/s (2DPC)

- Supports ECC/ non-ECC UDIMM, up to 128GB

∙ 2 x 1GbE RJ45 ports

- Intel® Ethernet controller I210-AT

- JLANCONN1 (L) support shared NIC*

∙ 2 x 10GbE RJ45 ports

- Intel® Ethernet controller X710-AT2

- JLAN1 support shared NIC*

* Only one NIC LAN port can be enabled at a time, either JLAN1 or JLANCONN1 (Lower).

∙ 4 x 2.5"/ 3.5" SATA hot-swap drive bays (front side)

∙ 2 x 2.5" SATＡ drive bays (internal)

∙ 6 x SATA 3.0 ports (w/ 1 x VCC)

∙ 2 x M.2 M-Key (PCIe 4.0 x4, 22110/ 2280)

- M

2_1*: Choose either M2_1 or PCIE_2 for the desired function.

2_2: Supports PCIe 4.0 x4

- M

* The PCIE_2 and M2_1 slots cannot operate simultaneously. You can use the JSEL_M1 jumper

to select which one to enable.

∙ 1x PCIe slot

- PCIE_1*:

PCIe 4.0 x16 signal with riser kit, FHHL (111.28mm x 167.65mm)

* The PCIE_1 expansion slot supports PCIe 5.0 x16 signal without a riser kit.

∙ TPM 2.0

∙ Case intrusion switch

∙ Aspeed AST2600 IPMI 2.0 with iKVM

∙ 1 x GbE RJ45 port (for Mgmt.)

- Chipset: Realtek

RTL8211FD-CG PHY

∙ 1 x Passive CPU heatsink @105W (with air duct)

∙ 4 x 40mm x 28mm PWM Hot-swap fans

∙ Operating Temperature: 0°C ~ 40°C

∙ Non-operating Temperature: -20°C ~ 70°C

∙ Operating Humidity: 0% ~ 85% (non-condensing)

Standard ATX 500W Power Supply

S1102-01

AMD B-class Chipset

1 x Slide Rail Kit (optional)

CE, FCC (Class A)

System Specifications