High-Flying HF-LPT120G Руководство пользователя - Страница 2
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Печатать страницуHF-LPT120G Low Power Wi-Fi Module User Manual
LIST OF FIGURES ................................................................................................................................... 3
LIST OF TABLES .................................................................................................................................... 4
HISTORY .................................................................................................................................................. 5
1.
PRODUCT OVERVIEW ................................................................................................................ 6
1.1.
General Description ................................................................................................................. 6
1.1.1
Device Features .................................................................................................................. 6
1.1.2
Device Paremeters ............................................................................................................. 7
1.1.3
Key Application ................................................................................................................... 7
1.2.
Hardware Introduction ............................................................................................................. 8
1.2.1.
Pins Definition ..................................................................................................................... 8
1.2.2.
Electrical Characteristics .................................................................................................... 9
1.2.3.
Mechanical Size ................................................................................................................10
1.2.4.
Order Information ..............................................................................................................11
1.3.
Typical Application ................................................................................................................11
2.
PACKAGE INFORMATION ........................................................................................................12
2.1.
Recommended Reflow Profile ..............................................................................................12
2.2.
Device Handling Instruction (Module IC SMT Preparation) ...............................................12
APPENDIX E: CONTACT INFORMATION ......................................................................................13
Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com)
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