HP 17 Инструкции по разборке изделия в конце срока службы - Страница 2
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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Screwdriver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove battery module
2.
Remove base rubber foot -L & -R
3.
Dis-fasten Base Cap -L & -R screw*2
4.
Remove Base Cap foot -L & -R
5.
Dis-fasten ODD screw*1
6.
Remove ODD
7.
Dis-fasten BASE screw*20
8.
Pull out FFC*3 (Power, Touchpad, keyboard membrane)
9.
Dis-fasten daughter boards screw*4 (Power, Touchpad)
10. Remove daughter boards*2 (Power, Touchpad )
11. Pull out wire cable *5(LCD, DC cable, HDD, ODD, speaker) Pull out FFC(USB, Battery)
12. Pull out Antenna cables
13. Dis-fasten Wireless screw*1
14. Remove Wireless card
15. Remove HDD
16. Dis-fasten USB boards screw*2
17. Remove USB boards
18. Dis-fasten motherboard screw*7
19. Remove motherboard
20. Remove Memory
21. Pull out fan cable
22. Dis-fasten Fan screws*1
23. Remove Fan
24. Dis-fasten thermal module screw*4
25. Remove thermal module
26. Remove ODD cable
27. Dis-fasten Battery boards screw*2
28. Remove Battery boards
29. Dis-fasten speaker screw*2
30. Remove speaker -L & -R
31. Dis-fasten Hinge screw*10
32. Remove DC cable
33. Remove LCD bezel
34. Pull out LCD cable & camera cable
35. Dis-fasten LCD Bezel screws*6
36. Remove LCD module
37. Remove Camera module
38. Dis-fasten LCD BKT -L & -R screws*4
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Tool Size (if
applicable)
#1
Page 2