Cypress CY62157EV18 Технический паспорт - Страница 4
Просмотреть онлайн или скачать pdf Технический паспорт для Компьютерное оборудование Cypress CY62157EV18. Cypress CY62157EV18 13 страниц. Mobl 8-mbit (512k x 16) static ram
Печатать страницуThermal Resistance
[8]
Parameter
Description
Θ
Thermal Resistance
JA
(Junction to Ambient)
Θ
Thermal Resistance
JC
(Junction to Case)
AC Test Loads and Waveforms
R1
V
CC
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
Parameters
R1
R2
R
TH
V
TH
Data Retention Characteristics
Parameter
Description
V
V
for Data Retention
DR
CC
I
Data Retention Current
CCDR
[8]
Chip Deselect to Data Retention Time
t
CDR
[9]
Operation Recovery Time
t
R
Data Retention Waveform
V
CC
CE
or
1
BHE.BLE
or
CE
2
Notes
9. Full device operation requires linear V
10. BHE.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling chip enable signals or by disabling both BHE and BLE.
Document #: 38-05490 Rev. *D
Test Conditions
Still air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
R2
Rise Time = 1 V/ns
Equivalent to:
THEVENIN EQUIVALENT
OUTPUT
Value
13500
10800
6000
0.80
(Over the Operating Range)
V
= V
CC
DR
CE
< 0.2V,V
2
[10]
DATA RETENTION MODE
V
CC(min)
t
CDR
> 100 µs or stable at V
ramp from V
to V
CC
DR
CC(min)
CY62157EV18 MoBL
ALL INPUT PULSES
3V
90%
10%
GND
R
TH
V
Conditions
, CE
> V
– 0.2V,
1
CC
> V
– 0.2V or V
< 0.2V
IN
CC
IN
V
> 1.0V
DR
> 100 µs.
CC(min)
BGA
Unit
°C/W
72
°C/W
8.86
90%
10%
Fall Time = 1 V/ns
Unit
Ω
Ω
Ω
V
[2]
Min
Max
Unit
Typ
1.0
V
µA
1
3
0
ns
t
ns
RC
V
CC(min)
t
R
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