Dell PowerApp .web 100 Güncelleme - Sayfa 2
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To install the microprocessor and heat sink on the new system board, perform the following steps:
1. Using the cleaning cloth supplied with the new system board, wipe the top of the microproces-
sor die to remove any previous thermal grease.
Once cleaned, the microprocessor die should have a reflective shine.
2. Insert the microprocessor into the ZIF socket on the new system board and lower the lever to
lock it into place.
3. Peel off the protective backing (if present) from the enclosed replacement heat sink to expose
the pad of thermal grease.
4. Place the heat sink on the microprocessor and ensure that the bevel on the heat sink covers the
raised portion of the ZIF socket.
5. Replace the heat sink clip onto the heat sink and secure it on the ZIF socket.
The longest side of the clip should be pointing to the front of the appliance.
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Information in this document is subject to change without notice.
© 2000 Dell Computer Corporation. All rights reserved. Printed in the U.S.A.
Trademarks used in this text: Dell, the DELL logo, and PowerApp are trademarks of Dell Computer Corporation. Other trademarks and
trade names may be used in this document to refer to either the entities claiming the marks and names or their products. Dell Computer
Corporation disclaims any proprietary interest in trademarks and trade names other than its own.