HP 406 G1 MT Sökme Talimatları Kılavuzu - Sayfa 2

Masaüstü HP 406 G1 MT için çevrimiçi göz atın veya pdf Sökme Talimatları Kılavuzu indirin. HP 406 G1 MT 12 sayfaları.

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HP 406 G1 MT Sökme Talimatları Kılavuzu
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 crisscross screw driver
Description #2 hexagon screw driver
Description #3 electric iron
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove access panel from the unit
2.
Remove front panel from the unit
3.
Remove all the cables from the unit
4.
Remove ODD from the unit
5.
Remove HDD from the unit
6.
Take off FIO from the unit
7.
Take off system fan from the unit
8.
Take off PSU from the unit.
9.
Take off Memory from the unit.
10.
Take off CPU cooler from the unit.
11.
Take off battery from the unit.
12.
Take off PCA from the unit.
13.
Open the PSU
14.
Take off PSU fan
15.
Take off CAP using electric iron.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
Tool Size (if
applicable)
2#
T15
QUICK 310
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