Toshiba 13A25C Посібник з експлуатації - Сторінка 3

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Також для Toshiba 13A25C: Посібник користувача (15 сторінок), Посібник з експлуатації (10 сторінок), Посібник з експлуатації (10 сторінок)

ABOUT LEAD FREE SOLDER (PbF)

Distinction of PbF PCB:

PCBs (manufactured) using lead free solder will have a PbF printing on the PCB.

(Please refer to figures.)

Caution:

•

Pb free solder has a higher melting point than standard solder;

Typically the melting point is 50°F~70°F(30°C~40°C) higher.

Please use a soldering iron with temperature control and adjust it to 650°F ± 20°F (350°C ± 10°C).

In case of using high temperature soldering iron, please be carefull not to heat too long.

•

Pb free solder will tend to splash when heated too high (about 1100°F/ 600°C).

•

All products with the printed circuit board with PbF printing must be serviced with lead free solder.

When soldering or unsoldering, completely remove all of the solder from the pins or solder area,

and be sure to heat the soldering points with the lead free solder until it melts sufficiently.

Recommendations

Recommended lead free solder composition is Sn-3.0Ag-0.5Cu.

A1-2

13A25/13A25C