CYNTEC TFP-21-S-140-B Посібник - Сторінка 9
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乾坤科技股份有限公司
乾坤科技股份有限公司
乾坤科技股份有限公司
乾坤科技股份有限公司
10. Soldering Condition
10-1 Carefully perform preheating so that the temperature difference (△T) between the solder and
the component surface should be in the follow range.
When the components are immersed in solvent after mounting, pay special attention to
maintain the temperature difference within 100℃.
Soldering must be carried out by the above mentioned conditions to prevent the components
from damage (crack etc.).
Contact Cyntec before use if concerning other soldering conditions.
Soldering method
Soldering iron method
Reflow method
When correcting the component with a soldering iron, the following conditions should be met.
Soldering iron wattage
Temperature of iron-tip
Diameter of iron-tip:φ3.0 mm max.
Do not allow the iron-tip to directly touch the ceramic element.
10-2 Use rosin type flux or weakly active flux with a chlorine content of 0.2 Wt% or less.
10-3 Use eutectic crystal solder.
10-4 Amount of solder paste
Ensure that solder is applied smoothly to a minimum height of 0.2 ~ 0.5 mm at the end surface of
the external electrodes. If too much or little solder is applied, there is high possibility that the
mechanical strength will be insufficient , creating the variation of the characteristics.
10-5 Manual hot gas soldering – available with the following condition
Pre-heating temperature : 120 ~ 150℃.
Maximum temperature : 275℃ , within 10.5 seconds
Item Kind of iron
Temperature
△T <= 130℃
Nichrome heater
< = 30 W
< = 280℃
DOCUMENT : RFB00000
REVISION
: A0
PAGE
: 9 OF 11
Ceramics heater
< = 18 W
< = 250℃