HP 10500 series Anweisungen für die Demontage - Seite 2

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HP 10500 series Anweisungen für die Demontage
Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unscrew the screws on part 1,then remove part 1;
2.
Unscrew the screws on guiding set 2,then remove guiding set 2;
3.
Remove shielding finger 3 from panel 8;
4.
Remove film 4 from panel 8;
5.
Unscrew the screws on heatsink 6,then remove heatsink 6 from pcb 7;
6.
Remove heatsink 5 from pcb 7;
7.
Unscrew the screws on PCB 7,then remove PCB 7 from bottom panel 8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.3 Material of the facility built
Facility
Components
1
2
3
4
5
6
EL-MF877-00
Template Revision B
Figure1 Treatments to the product
Material
Weight(g)
Fe
48
Zn
32
Be-Cu
2.7
PC
9.2
Al
10.5
Al
225
Weight
Selective treatment for
percentage
materials and components
1.67%
1.11%
0.09%
0.32%
0.37%
7.84%
Tool Size (if
applicable)
2#
Details
Fe recycling
Zn recycling
Cu recycling
Pla
recycling
Al recycling
Al recycling
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