HP 10500 series 분해 지침 - 페이지 2
{카테고리_이름} HP 10500 series에 대한 분해 지침을 온라인으로 검색하거나 PDF를 다운로드하세요. HP 10500 series 3 페이지. Type d w/comware v7 os mpu (jh198a). product end-of-life disassembly
HP 10500 series에 대해서도 마찬가지입니다: 사양 (42 페이지), 데이터시트 (8 페이지), 데이터시트 (20 페이지), 사양 (20 페이지)
페이지 인쇄
Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unscrew the screws on part 1,then remove part 1;
2.
Unscrew the screws on guiding set 2,then remove guiding set 2;
3.
Remove shielding finger 3 from panel 8;
4.
Remove film 4 from panel 8;
5.
Unscrew the screws on heatsink 6,then remove heatsink 6 from pcb 7;
6.
Remove heatsink 5 from pcb 7;
7.
Unscrew the screws on PCB 7,then remove PCB 7 from bottom panel 8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.3 Material of the facility built
Facility
Components
1
2
3
4
5
6
EL-MF877-00
Template Revision B
Figure1 Treatments to the product
Material
Weight(g)
Fe
48
Zn
32
Be-Cu
2.7
PC
9.2
Al
10.5
Al
225
Weight
Selective treatment for
percentage
materials and components
1.67%
1.11%
0.09%
0.32%
0.37%
7.84%
Tool Size (if
applicable)
2#
Details
Fe recycling
Zn recycling
Cu recycling
Pla
recycling
Al recycling
Al recycling
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