Cypress Semiconductor MoBL-USB CY7C68000A Spezifikationsblatt - Seite 13

Blättern Sie online oder laden Sie pdf Spezifikationsblatt für Computer Hardware Cypress Semiconductor MoBL-USB CY7C68000A herunter. Cypress Semiconductor MoBL-USB CY7C68000A 16 Seiten. Tx2 usb 2.0 utmi transceiver

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Package Diagrams
Figure 7. 56 VFBGA (5 x 5 x 1.0 mm) 0.50 Pitch, 0.30 Ball BZ56
TOP VIEW
PIN A1 CORNER
1
2
3
A
B
C
D
E
F
G
H
5.00±0.10
SIDE VIEW
-C-
SEATING PLANE

PCB Layout Recommendations

Follow these recommendations to ensure reliable, high-perfor-
[3]
mance operation
.
A four-layer impedance controlled board is required to maintain
■
signal quality
Specify impedance targets (ask your board vendor what they
■
can achieve)
To control impedance, maintain trace widths and trace spacing
■
to within written specifications
Minimize stubs to minimize reflected signals
■
Note
3. Source for recommendations: EZ-USB FX2™ PCB Design Recommendations, http:///www.cypress.com/cfuploads/support/app_notes/FX2_PCB.pdf
High-Speed USB Platform Design Guidelines, http://www.usb.org/developers/docs/hs_usb_pdg_r1_0.pdf.
Document #: 38-08052 Rev. *G
(continued)
4
5
6
6
8
BOTTOM VIEW
8
7
-B-
-A-
0.10(4X)
REFERENCE JEDEC: MO-195C
PACKAGE WEIGHT: 0.02 grams
Connections between the USB connector shell and signal
■
ground must be done near the USB connector
Bypass and flyback capacitors on VBus, near the connector,
■
are recommended
Keep DPLUS and DMINUS trace lengths within 2 mm of each
■
other in length, with preferred length of 20 to 30 mm
Maintain a solid ground plane under the DPLUS and DMINUS
■
traces. Do not split the plane under these traces
Do not place vias on the DPLUS or DMINUS trace routing
■
Isolate the DPLUS and DMINUS traces from all other signal
■
traces by no less than 10 mm
CY7C68000A
Ø0.05 M C
Ø0.15 M C A B
A1 CORNER
Ø0.30±0.05(56X)
6
5
4
3
2
1
A
B
C
D
E
F
G
H
0.50
3.50
5.00±0.10
001-03901-*B
Page 13 of 15
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