HP 234664-002 - ProLiant - ML330T02 Visión general

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HP 234664-002 - ProLiant - ML330T02 Visión general
Memory technology evolution: an overview
of system memory technologies
technology brief, 8
th
Abstract.............................................................................................................................................. 2
Introduction......................................................................................................................................... 2
Basic DRAM operation ......................................................................................................................... 2
DRAM storage density and power consumption ................................................................................... 4
Memory access time......................................................................................................................... 4
Chipsets and system bus timing.......................................................................................................... 4
Memory bus speed........................................................................................................................... 5
Burst mode access............................................................................................................................ 5
SDRAM technology .............................................................................................................................. 6
Bank interleaving ............................................................................................................................. 7
Increased bandwidth ........................................................................................................................ 7
Registered SDRAM modules .............................................................................................................. 7
DIMM Configurations ....................................................................................................................... 8
Memory channel interleaving .......................................................................................................... 10
Advanced memory technologies .......................................................................................................... 11
Double Data Rate SDRAM technologies ............................................................................................ 11
Fully-Buffered DIMMs...................................................................................................................... 15
Rambus DRAM .............................................................................................................................. 18
Importance of using HP-certified memory modules in ProLiant servers ....................................................... 19
Conclusion........................................................................................................................................ 19
For more information.......................................................................................................................... 20
Call to action .................................................................................................................................... 20
edition
Single-sided and double-sided DIMMs ............................................................................................ 8
Single-rank, dual-rank, and quad-rank DIMMs ................................................................................. 8
Rank interleaving.......................................................................................................................... 9
DDR-1 ....................................................................................................................................... 11
DDR-2 ....................................................................................................................................... 13
DDR-3 ....................................................................................................................................... 14
Module naming convention and peak bandwidth ........................................................................... 14
FB-DIMM architecture.................................................................................................................. 16
Challenges ................................................................................................................................ 17