HP 234664-002 - ProLiant - ML330T02 Przegląd

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Również dla HP 234664-002 - ProLiant - ML330T02: Często zadawane pytania (4 strony), Podręcznik wdrażania (35 strony), Biała księga techniczna (12 strony), Aktualizacja oprogramowania sprzętowego (9 strony), Podręcznik wdrażania (26 strony), Wprowadzenie Podręcznik (22 strony), Instrukcja rozwiązywania problemów (18 strony), Podręcznik wdrażania (11 strony), Instrukcja instalacji (2 strony), Podręcznik konfiguracji (2 strony), Wprowadzenie Podręcznik (19 strony), Aktualizacja instrukcji (9 strony), Aktualizacja instrukcji (16 strony), Wprowadzenie Podręcznik (10 strony), Instrukcja instalacji (15 strony), Krótki opis technologii (9 strony)

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HP 234664-002 - ProLiant - ML330T02 Przegląd
Memory technology evolution: an overview
of system memory technologies
technology brief, 8
th
Abstract.............................................................................................................................................. 2
Introduction......................................................................................................................................... 2
Basic DRAM operation ......................................................................................................................... 2
DRAM storage density and power consumption ................................................................................... 4
Memory access time......................................................................................................................... 4
Chipsets and system bus timing.......................................................................................................... 4
Memory bus speed........................................................................................................................... 5
Burst mode access............................................................................................................................ 5
SDRAM technology .............................................................................................................................. 6
Bank interleaving ............................................................................................................................. 7
Increased bandwidth ........................................................................................................................ 7
Registered SDRAM modules .............................................................................................................. 7
DIMM Configurations ....................................................................................................................... 8
Memory channel interleaving .......................................................................................................... 10
Advanced memory technologies .......................................................................................................... 11
Double Data Rate SDRAM technologies ............................................................................................ 11
Fully-Buffered DIMMs...................................................................................................................... 15
Rambus DRAM .............................................................................................................................. 18
Importance of using HP-certified memory modules in ProLiant servers ....................................................... 19
Conclusion........................................................................................................................................ 19
For more information.......................................................................................................................... 20
Call to action .................................................................................................................................... 20
edition
Single-sided and double-sided DIMMs ............................................................................................ 8
Single-rank, dual-rank, and quad-rank DIMMs ................................................................................. 8
Rank interleaving.......................................................................................................................... 9
DDR-1 ....................................................................................................................................... 11
DDR-2 ....................................................................................................................................... 13
DDR-3 ....................................................................................................................................... 14
Module naming convention and peak bandwidth ........................................................................... 14
FB-DIMM architecture.................................................................................................................. 16
Challenges ................................................................................................................................ 17