Dell PowerEdge M910 Panduan Teknis - Halaman 3

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Halaman Cetak

1 Product comparison .......................................................................................................................................................... 6

Powerful performance ...................................................................................................................................................... 6

Scaling capability ............................................................................................................................................................... 6

High reliability ..................................................................................................................................................................... 6

Product comparison .......................................................................................................................................................... 7

2 Key technologies ................................................................................................................................................................ 9

Intel 7510 chipset ............................................................................................................................................................... 9

Intel processors .................................................................................................................................................................. 9

FlexMem Bridge .......................................................................................................................................................... 10

I/O Hub (IOH) with Intel QuickPath Architecture ................................................................................................. 10

DDR3 memory ............................................................................................................................................................ 10

PCIe 2.0 ........................................................................................................................................................................ 10

Internal redundant SD module ................................................................................................................................. 10

iDRAC6 Express ........................................................................................................................................................... 10

3 System information ........................................................................................................................................................... 11

Product features summary ............................................................................................................................................. 11

4 Mechanical ......................................................................................................................................................................... 13

Module dimensions and weight ..................................................................................................................................... 13

Internal module ................................................................................................................................................................. 13

Security ...............................................................................................................................................................................14

Cover latch.........................................................................................................................................................................14

TPM (Trusted Platform Module) .....................................................................................................................................14

Power off security............................................................................................................................................................. 15

USB key ............................................................................................................................................................................... 15

Battery ................................................................................................................................................................................. 15

Field replaceable units (FRU) .......................................................................................................................................... 15

5 Power, thermal and acoustics ........................................................................................................................................ 16

Acoustics ............................................................................................................................................................................ 17

Definitions: .................................................................................................................................................................... 17

Thermal ..............................................................................................................................................................................18

Power efficiency ...............................................................................................................................................................18

6 Processors .......................................................................................................................................................................... 19

Features .............................................................................................................................................................................. 19

Supported processors ..................................................................................................................................................... 20

Processor configurations ................................................................................................................................................ 21

FlexMem Bridge ................................................................................................................................................................ 21

7 Memory .............................................................................................................................................................................. 23

DIMMs supported ............................................................................................................................................................ 23

DIMM slots ........................................................................................................................................................................ 23

Intel 7500 SMB ................................................................................................................................................................. 23

Memory RAS support ...................................................................................................................................................... 24

Sparing .......................................................................................................................................................................... 24

Mirroring ....................................................................................................................................................................... 24

Supported memory configurations .............................................................................................................................. 24

8 Chipset ............................................................................................................................................................................... 25

Intel 7500 I/O Hub (IOH) ................................................................................................................................................ 25

IOH QuickPath Interconnect (QPI) .............................................................................................................................. 25

PCIe 2.0 ............................................................................................................................................................................. 25

Direct Media Interface .................................................................................................................................................... 25

Intel I/O Controller Hub 10 ............................................................................................................................................ 25

PCIe mezzanine connectors ......................................................................................................................................... 26

PowerEdge M910 Technical Guide

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Dell PowerEdge M910 Panduan Teknis - Halaman 3

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