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HP Xw460c - ProLiant - Blade Workstation 概要
Technologies in the HP BladeSystem c7000
Enclosure
technology brief, 4th edition
Abstract .............................................................................................................................................. 3
Overview of HP BladeSystem c7000 Enclosure ....................................................................................... 3
Enclosure management ......................................................................................................................... 5
BladeSystem Onboard Administrator .................................................................................................. 5
Insight Display ............................................................................................................................... 10
HP Insight Control suite ................................................................................................................... 11
Interconnect options and infrastructure.................................................................................................. 12
Interconnect modules ...................................................................................................................... 13
Server blades ................................................................................................................................ 14
Storage options inside the BladeSystem enclosure .............................................................................. 14
Mezzanine cards ........................................................................................................................... 16
Virtual Connect .............................................................................................................................. 16
Fabric connectivity and port mapping ............................................................................................... 17
c7000 bay-to-bay crosslinks ............................................................................................................ 19
HP Thermal Logic technologies ............................................................................................................ 20
Active Cool 200 fans ..................................................................................................................... 20
HP PARSEC architecture .................................................................................................................. 21
Thermal Logic for the server blade .................................................................................................... 24
Power supplies and enclosure power subsystem ................................................................................. 25
Detecting component insertion and removal ..................................................................................... 6
Identifying components ................................................................................................................. 6
Managing power and cooling ....................................................................................................... 6
Controlling components ................................................................................................................. 7
Redundant enclosure management ................................................................................................. 8
User interfaces for the BladeSystem Onboard Administrator .............................................................. 8
Security ....................................................................................................................................... 8
Role-based user accounts............................................................................................................... 9
Enclosure linking .......................................................................................................................... 9
Direct attach storage blades ........................................................................................................ 14
Shared storage .......................................................................................................................... 15
NAS/SAN Gateway .................................................................................................................. 15
Storage server ............................................................................................................................ 15
Device bay crosslinks .................................................................................................................. 19
Interconnect bay crosslinks .......................................................................................................... 19
Parallel ...................................................................................................................................... 21
Redundant ................................................................................................................................. 23
Scalable .................................................................................................................................... 24
Pooled power ............................................................................................................................ 27