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スイッチ HP Xw460c - ProLiant - Blade WorkstationのPDF 概要をオンラインで閲覧またはダウンロードできます。HP Xw460c - ProLiant - Blade Workstation 35 ページ。 Mezzanine card installation instructions for supported hp proliant c-class bladesystem servers
HP Xw460c - ProLiant - Blade Workstation にも: 実施マニュアル (35 ページ), エラー防止マニュアル (12 ページ), テクニカル・ホワイトペーパー (12 ページ), ファームウェア・アップデート (9 ページ), インストレーション・マニュアル (2 ページ), よくある質問マニュアル (14 ページ), セットアップポスター (9 ページ), インストレーション・マニュアル (33 ページ), マネジメント・マニュアル (28 ページ), ハードウェアマニュアル (23 ページ), ユーザーマニュアル (33 ページ), 最適化マニュアル (13 ページ), 限定保証 (10 ページ), 取付説明書 (10 ページ), 取付説明書 (8 ページ), インストレーション・インストラクション (4 ページ), インストレーション・インストラクション (2 ページ)

HP Xw460c - ProLiant - Blade Workstation 概要

Abstract

The HP BladeSystem c7000 Enclosure is an evolution of the entire rack-mounted infrastructure. It
consolidates and repackages all the supporting infrastructure elements―compute, storage, network,
and power―into a single ―infrastructure-in-a-box‖ that accelerates the integration and optimization of
the data center. This technology brief provides an overview of the HP BladeSystem c7000 Enclosure,
including Thermal Logic power and cooling technologies and interconnect options.
It is assumed that the reader is familiar with HP ProLiant server technology and has some general
knowledge of BladeSystem architecture. More information about the infrastructure components and
BladeSystem technologies is available on the HP website:

Overview of HP BladeSystem c7000 Enclosure

The HP BladeSystem c7000 Enclosure was the first enclosure implemented using the BladeSystem
c-Class architecture.
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It is optimized for enterprise data center applications. It fits into standard size
HP and third-party racks; accommodates BladeSystem c-Class server blades, storage blades, and
interconnect modules; and provides all the power, cooling, and I/O infrastructure needed to support
them throughout the next several years.
The c7000 enclosure can be populated with the following components:
Up to 8 full-height (FH) or 16 half-height (HH) server, storage, or other option blades per enclosure
Up to eight interconnect modules simultaneously supporting a variety of network interconnect fabrics
such as Ethernet, Fibre Channel (FC), InfiniBand (IB), Internet Small Computer System Interface
(iSCSI), or Serial-attached SCSI (SAS)
Up to 10 Active Cool 200 fan kits
Up to six power supplies
Redundant BladeSystem Onboard Administrator (OA) management modules (optional active-
standby design)
Figures 1 and 2 show front and rear views of the c7000 enclosure. The c7000 enclosure and the
c3000 enclosure support many of the same critical components such as servers, interconnects,
mezzanine cards, storage blades, power supplies, and fans.
1
HP also offers the HP BladeSystem c3000 Enclosure, which is optimized for remote sites or small businesses.
More information about the c3000 enclosure is in the technology brief titled ―HP BladeSystem c3000 Enclosure
technologies‖:
http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01508406/c01508406.pdf
www.hp.com/go/bladesystem
.
.
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