HP Xw460c - ProLiant - Blade Workstation Genel Bakış - Sayfa 3

Anahtar HP Xw460c - ProLiant - Blade Workstation için çevrimiçi göz atın veya pdf Genel Bakış indirin. HP Xw460c - ProLiant - Blade Workstation 35 sayfaları. Mezzanine card installation instructions for supported hp proliant c-class bladesystem servers
Ayrıca HP Xw460c - ProLiant - Blade Workstation için: Uygulama Kılavuzu (35 sayfalar), Hata Önleme Kılavuzu (12 sayfalar), Teknik Beyaz Kitap (12 sayfalar), Ürün Yazılımı Güncellemesi (9 sayfalar), Kurulum Kılavuzu (2 sayfalar), Sıkça Sorulan Sorular Kılavuzu (14 sayfalar), Kurulum Posteri (9 sayfalar), Kurulum Kılavuzu (33 sayfalar), Yönetim Kılavuzu (28 sayfalar), Donanım Kılavuzu (23 sayfalar), Kullanıcı Kılavuzu (33 sayfalar), Optimizasyon Kılavuzu (13 sayfalar), Sınırlı Garanti (10 sayfalar), Kurulum Talimatları Kılavuzu (10 sayfalar), Kurulum Talimatları Kılavuzu (8 sayfalar), Kurulum Talimatları (4 sayfalar), Kurulum Talimatları (2 sayfalar)

Abstract

The HP BladeSystem c7000 Enclosure is an evolution of the entire rack-mounted infrastructure. It

consolidates and repackages all the supporting infrastructure elements―compute, storage, network,

and power―into a single ―infrastructure-in-a-box‖ that accelerates the integration and optimization of

the data center. This technology brief provides an overview of the HP BladeSystem c7000 Enclosure,

including Thermal Logic power and cooling technologies and interconnect options.

It is assumed that the reader is familiar with HP ProLiant server technology and has some general

knowledge of BladeSystem architecture. More information about the infrastructure components and

BladeSystem technologies is available on the HP website:

The HP BladeSystem c7000 Enclosure was the first enclosure implemented using the BladeSystem

c-Class architecture.

It is optimized for enterprise data center applications. It fits into standard size

HP and third-party racks; accommodates BladeSystem c-Class server blades, storage blades, and

interconnect modules; and provides all the power, cooling, and I/O infrastructure needed to support

them throughout the next several years.

The c7000 enclosure can be populated with the following components:

Up to 8 full-height (FH) or 16 half-height (HH) server, storage, or other option blades per enclosure

Up to eight interconnect modules simultaneously supporting a variety of network interconnect fabrics

such as Ethernet, Fibre Channel (FC), InfiniBand (IB), Internet Small Computer System Interface

(iSCSI), or Serial-attached SCSI (SAS)

Up to 10 Active Cool 200 fan kits

Up to six power supplies

Redundant BladeSystem Onboard Administrator (OA) management modules (optional active-

standby design)

Figures 1 and 2 show front and rear views of the c7000 enclosure. The c7000 enclosure and the

c3000 enclosure support many of the same critical components such as servers, interconnects,

mezzanine cards, storage blades, power supplies, and fans.

HP also offers the HP BladeSystem c3000 Enclosure, which is optimized for remote sites or small businesses.

More information about the c3000 enclosure is in the technology brief titled ―HP BladeSystem c3000 Enclosure

technologies‖:

http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01508406/c01508406.pdf