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ISS Technology Update

Volume 7, Number 1

Key technologies in the HP BladeSystem c3000 Enclosure – tower version

This article summarizes the key technologies in the tower version of the HP BladeSystem c3000 Enclosure, including Thermal

Logic power and cooling technologies, interconnect and storage options, HP Virtual Connect, and Onboard Administrator.

Detailed information about these technologies, which are also implemented in the rack version of the HP BladeSystem c3000

Enclosure, is available at http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01204885/c01204885.pdf.

Overview

The c3000 enclosure tower version accommodates c-Class form-factor server/storage blades and interconnect modules. It has

the flexibility to hold up to eight half-height (HH) or four full-height (FH) server blades, six Active Cools fans, and six power

supplies (Figure 2-1). Both the BladeSystem c3000 tower and rack enclosures are optimized for remote sites, small and

medium-sized businesses, and data centers with special power and cooling constraints or data centers with low power and

cooling capacities. A major advantage of the tower version is that it requires no rack, which provides greater versatility for

deploying blades in environments with constrained space. Also, its built-in wheels make it a very flexible solution.

Figure 2-1. Front and back views of the c3000 enclosure - tower version

HP Thermal Logic includes the mechanical design features, built-in intelligence, and control capabilities that minimize power

and cooling use while maintaining adequate cooling for all devices in the c3000 Enclosure. Thermal Logic technologies allow

administrators to view power use and temperature at the server or enclosure level. There are numerous HP Thermal Logic

technologies:

• Active Cool fans

• Parallel Redundant Scalable Enclosure (PARSEC) design

• Instant power and thermal monitoring

• Pooled power for a variety of power redundancy modes

• Dynamic Power Saver mode

• Power Regulator

• Power workload balancing