HP 234664-002 - ProLiant - ML330T02 소개 매뉴얼

{카테고리_이름} HP 234664-002 - ProLiant - ML330T02에 대한 소개 매뉴얼을 온라인으로 검색하거나 PDF를 다운로드하세요. HP 234664-002 - ProLiant - ML330T02 22 페이지. Visualization and acceleration in hp proliant servers
HP 234664-002 - ProLiant - ML330T02에 대해서도 마찬가지입니다: 자주 묻는 질문 (4 페이지), 구현 매뉴얼 (35 페이지), 기술 백서 (12 페이지), 펌웨어 업데이트 (9 페이지), 개요 (20 페이지), 구현 매뉴얼 (26 페이지), 문제 해결 매뉴얼 (18 페이지), 구현 매뉴얼 (11 페이지), 설치 매뉴얼 (2 페이지), 구성 매뉴얼 (2 페이지), 소개 매뉴얼 (19 페이지), 업데이트 매뉴얼 (9 페이지), 업데이트 매뉴얼 (16 페이지), 소개 매뉴얼 (10 페이지), 설치 지침 매뉴얼 (15 페이지), 기술 개요 (9 페이지)

HP 234664-002 - ProLiant - ML330T02 소개 매뉴얼
The Intel
processor roadmap for industry-
®
standard servers
technology brief, 10
Abstract ..............................................................................................................................................2
Introduction .........................................................................................................................................2
Intel processor architecture and microarchitectures ...................................................................................2
Hyper-pipeline and clock frequency ....................................................................................................5
Hyper-Threading Technology..............................................................................................................7
NetBurst microarchitecture on 90nm silicon process technology .............................................................9
Two-core technology .......................................................................................................................11
Intel Core™ microarchitecture ..............................................................................................................12
Processors......................................................................................................................................12
Xeon two-core processors ................................................................................................................12
Xeon four-core processors ................................................................................................................13
Integrated memory controller............................................................................................................15
Three-level cache hierarchy ..............................................................................................................17
Dynamic Power Management...........................................................................................................19
Performance comparisons....................................................................................................................20
TPC-C performance .........................................................................................................................20
SPEC performance ..........................................................................................................................20
Conclusion ........................................................................................................................................21
For more information ..........................................................................................................................22
Call to action .....................................................................................................................................22
th
Edition
®
microarchitecture ...................................................................................................................5
Extended hyper-pipeline...............................................................................................................10
SSE3 instructions.........................................................................................................................10
64-bit extensions -Intel 64 ..........................................................................................................10
Enhanced SpeedStep® Technology ...............................................................................................14
Intel Virtualization® Technology....................................................................................................15
®
Microarchitecture Nehalem .........................................................................................................15
QuickPath Technology ............................................................................................................16
®
Hyper-Threading Technology ...................................................................................................18
®
®
Turbo Boost Technology ..........................................................................................................18