HP 234664-002 - ProLiant - ML330T02 Giriş Kılavuzu

Masaüstü HP 234664-002 - ProLiant - ML330T02 için çevrimiçi göz atın veya pdf Giriş Kılavuzu indirin. HP 234664-002 - ProLiant - ML330T02 22 sayfaları. Visualization and acceleration in hp proliant servers
Ayrıca HP 234664-002 - ProLiant - ML330T02 için: Sıkça Sorulan Sorular (4 sayfalar), Uygulama Kılavuzu (35 sayfalar), Teknik Beyaz Kitap (12 sayfalar), Ürün Yazılımı Güncellemesi (9 sayfalar), Genel Bakış (20 sayfalar), Uygulama Kılavuzu (26 sayfalar), Sorun Giderme Kılavuzu (18 sayfalar), Uygulama Kılavuzu (11 sayfalar), Kurulum Kılavuzu (2 sayfalar), Yapılandırma Kılavuzu (2 sayfalar), Giriş Kılavuzu (19 sayfalar), Güncelleme Kılavuzu (9 sayfalar), Güncelleme Kılavuzu (16 sayfalar), Giriş Kılavuzu (10 sayfalar), Kurulum Talimatları Kılavuzu (15 sayfalar), Teknoloji Özeti (9 sayfalar)

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HP 234664-002 - ProLiant - ML330T02 Giriş Kılavuzu
The Intel
processor roadmap for industry-
®
standard servers
technology brief, 10
Abstract ..............................................................................................................................................2
Introduction .........................................................................................................................................2
Intel processor architecture and microarchitectures ...................................................................................2
Hyper-pipeline and clock frequency ....................................................................................................5
Hyper-Threading Technology..............................................................................................................7
NetBurst microarchitecture on 90nm silicon process technology .............................................................9
Two-core technology .......................................................................................................................11
Intel Core™ microarchitecture ..............................................................................................................12
Processors......................................................................................................................................12
Xeon two-core processors ................................................................................................................12
Xeon four-core processors ................................................................................................................13
Integrated memory controller............................................................................................................15
Three-level cache hierarchy ..............................................................................................................17
Dynamic Power Management...........................................................................................................19
Performance comparisons....................................................................................................................20
TPC-C performance .........................................................................................................................20
SPEC performance ..........................................................................................................................20
Conclusion ........................................................................................................................................21
For more information ..........................................................................................................................22
Call to action .....................................................................................................................................22
th
Edition
®
microarchitecture ...................................................................................................................5
Extended hyper-pipeline...............................................................................................................10
SSE3 instructions.........................................................................................................................10
64-bit extensions -Intel 64 ..........................................................................................................10
Enhanced SpeedStep® Technology ...............................................................................................14
Intel Virtualization® Technology....................................................................................................15
®
Microarchitecture Nehalem .........................................................................................................15
QuickPath Technology ............................................................................................................16
®
Hyper-Threading Technology ...................................................................................................18
®
®
Turbo Boost Technology ..........................................................................................................18