HP 234664-002 - ProLiant - ML330T02 Introduction Manual

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Also for HP 234664-002 - ProLiant - ML330T02: Frequently Asked Questions (4 pages), Implementation Manual (35 pages), Technical White Paper (12 pages), Firmware Update (9 pages), Overview (20 pages), Implementation Manual (26 pages), Troubleshooting Manual (18 pages), Implementation Manual (11 pages), Installation Manual (2 pages), Configuration Manual (2 pages), Introduction Manual (19 pages), Update Manual (9 pages), Update Manual (16 pages), Introduction Manual (10 pages), Installation Instructions Manual (15 pages), Technology Brief (9 pages)

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HP 234664-002 - ProLiant - ML330T02 Introduction Manual
The Intel
processor roadmap for industry-
®
standard servers
technology brief, 10
Abstract ..............................................................................................................................................2
Introduction .........................................................................................................................................2
Intel processor architecture and microarchitectures ...................................................................................2
Hyper-pipeline and clock frequency ....................................................................................................5
Hyper-Threading Technology..............................................................................................................7
NetBurst microarchitecture on 90nm silicon process technology .............................................................9
Two-core technology .......................................................................................................................11
Intel Core™ microarchitecture ..............................................................................................................12
Processors......................................................................................................................................12
Xeon two-core processors ................................................................................................................12
Xeon four-core processors ................................................................................................................13
Integrated memory controller............................................................................................................15
Three-level cache hierarchy ..............................................................................................................17
Dynamic Power Management...........................................................................................................19
Performance comparisons....................................................................................................................20
TPC-C performance .........................................................................................................................20
SPEC performance ..........................................................................................................................20
Conclusion ........................................................................................................................................21
For more information ..........................................................................................................................22
Call to action .....................................................................................................................................22
th
Edition
®
microarchitecture ...................................................................................................................5
Extended hyper-pipeline...............................................................................................................10
SSE3 instructions.........................................................................................................................10
64-bit extensions -Intel 64 ..........................................................................................................10
Enhanced SpeedStep® Technology ...............................................................................................14
Intel Virtualization® Technology....................................................................................................15
®
Microarchitecture Nehalem .........................................................................................................15
QuickPath Technology ............................................................................................................16
®
Hyper-Threading Technology ...................................................................................................18
®
®
Turbo Boost Technology ..........................................................................................................18