HP 234664-002 - ProLiant - ML330T02 Introduction Manual

Browse online or download pdf Introduction Manual for Desktop HP 234664-002 - ProLiant - ML330T02. HP 234664-002 - ProLiant - ML330T02 10 pages. Visualization and acceleration in hp proliant servers
Also for HP 234664-002 - ProLiant - ML330T02: Frequently Asked Questions (4 pages), Implementation Manual (35 pages), Technical White Paper (12 pages), Firmware Update (9 pages), Overview (20 pages), Implementation Manual (26 pages), Introduction Manual (22 pages), Troubleshooting Manual (18 pages), Implementation Manual (11 pages), Installation Manual (2 pages), Configuration Manual (2 pages), Introduction Manual (19 pages), Update Manual (9 pages), Update Manual (16 pages), Installation Instructions Manual (15 pages), Technology Brief (9 pages)

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HP 234664-002 - ProLiant - ML330T02 Introduction Manual
Fully-Buffered DIMM technology in HP ProLiant servers
technology brief
Abstract.............................................................................................................................................. 2
Introduction......................................................................................................................................... 2
Performance barriers for traditional DIMM.............................................................................................. 2
Fully-Buffered DIMM architecture ........................................................................................................... 4
Benefits........................................................................................................................................... 6
Simplified board design ................................................................................................................ 6
Higher memory capacity ............................................................................................................... 6
Higher performance...................................................................................................................... 7
Improved reliability....................................................................................................................... 7
Challenges ...................................................................................................................................... 8
Latency ....................................................................................................................................... 8
Power and thermal loads............................................................................................................... 8
Performance tuning, achieving maximum performance ............................................................................. 9
Conclusion.......................................................................................................................................... 9
For more information.......................................................................................................................... 10
Call to action .................................................................................................................................... 10