HP 234664-002 - ProLiant - ML330T02 Panduan Pengenalan

Jelajahi secara online atau unduh pdf Panduan Pengenalan untuk Desktop HP 234664-002 - ProLiant - ML330T02. HP 234664-002 - ProLiant - ML330T02 10 halaman. Visualization and acceleration in hp proliant servers
Juga untuk HP 234664-002 - ProLiant - ML330T02: Pertanyaan yang Sering Diajukan (4 halaman), Panduan Pelaksanaan (35 halaman), Buku Putih Teknis (12 halaman), Pembaruan Firmware (9 halaman), Ikhtisar (20 halaman), Panduan Pelaksanaan (26 halaman), Panduan Pengenalan (22 halaman), Panduan Pemecahan Masalah (18 halaman), Panduan Pelaksanaan (11 halaman), Panduan Instalasi (2 halaman), Panduan Konfigurasi (2 halaman), Panduan Pengenalan (19 halaman), Manual Pembaruan (9 halaman), Manual Pembaruan (16 halaman), Panduan Petunjuk Instalasi (15 halaman), Ringkasan Teknologi (9 halaman)

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HP 234664-002 - ProLiant - ML330T02 Panduan Pengenalan
Fully-Buffered DIMM technology in HP ProLiant servers
technology brief
Abstract.............................................................................................................................................. 2
Introduction......................................................................................................................................... 2
Performance barriers for traditional DIMM.............................................................................................. 2
Fully-Buffered DIMM architecture ........................................................................................................... 4
Benefits........................................................................................................................................... 6
Simplified board design ................................................................................................................ 6
Higher memory capacity ............................................................................................................... 6
Higher performance...................................................................................................................... 7
Improved reliability....................................................................................................................... 7
Challenges ...................................................................................................................................... 8
Latency ....................................................................................................................................... 8
Power and thermal loads............................................................................................................... 8
Performance tuning, achieving maximum performance ............................................................................. 9
Conclusion.......................................................................................................................................... 9
For more information.......................................................................................................................... 10
Call to action .................................................................................................................................... 10