HP 234664-002 - ProLiant - ML330T02 Inleiding Handboek

Blader online of download pdf Inleiding Handboek voor {categorie_naam} HP 234664-002 - ProLiant - ML330T02. HP 234664-002 - ProLiant - ML330T02 10 pagina's. Visualization and acceleration in hp proliant servers
Ook voor HP 234664-002 - ProLiant - ML330T02: Veelgestelde vragen (4 pagina's), Implementatiehandleiding (35 pagina's), Technisch witboek (12 pagina's), Firmware bijwerken (9 pagina's), Overzicht (20 pagina's), Implementatiehandleiding (26 pagina's), Inleiding Handboek (22 pagina's), Handleiding voor probleemoplossing (18 pagina's), Implementatiehandleiding (11 pagina's), Installatiehandleiding (2 pagina's), Configuratiehandleiding (2 pagina's), Inleiding Handboek (19 pagina's), Handleiding bijwerken (9 pagina's), Handleiding bijwerken (16 pagina's), Handleiding voor installatie-instructies (15 pagina's), Beknopte technologie (9 pagina's)

HP 234664-002 - ProLiant - ML330T02 Inleiding Handboek
Fully-Buffered DIMM technology in HP ProLiant servers
technology brief
Abstract.............................................................................................................................................. 2
Introduction......................................................................................................................................... 2
Performance barriers for traditional DIMM.............................................................................................. 2
Fully-Buffered DIMM architecture ........................................................................................................... 4
Benefits........................................................................................................................................... 6
Simplified board design ................................................................................................................ 6
Higher memory capacity ............................................................................................................... 6
Higher performance...................................................................................................................... 7
Improved reliability....................................................................................................................... 7
Challenges ...................................................................................................................................... 8
Latency ....................................................................................................................................... 8
Power and thermal loads............................................................................................................... 8
Performance tuning, achieving maximum performance ............................................................................. 9
Conclusion.......................................................................................................................................... 9
For more information.......................................................................................................................... 10
Call to action .................................................................................................................................... 10