Epson SED1530 Series 기술 매뉴얼 - 페이지 13

{카테고리_이름} Epson SED1530 Series에 대한 기술 매뉴얼을 온라인으로 검색하거나 PDF를 다운로드하세요. Epson SED1530 Series 40 페이지. Lcd driver with ram

Epson SED1530 Series 기술 매뉴얼
SED1520 Series

PAD

Pad Arrangement
Chip specifications of AL pad package
Chip size: 4.80 7.04 0.400 mm
Pad pitch: 100 100 m
Note: An example of SED1520D
package.
2–4
100
95
90
1
5
10
Y
15
(0, 0)
20
25
30
35
40
4.80 mm
die numbers is given. These numbers are the same as the bump
AA
EPSON
Chip specifications of gold bump package
Chip size:
4.80 7.04 0.525 mm
Bump pitch: 199 m (Min.)
Bump height: 22.5 m (Typ.)
Bump size:
132 111 m ( 20 m) for mushroom
model
116 92 m ( 4 m) for vertical model
85
80
75
70
X
65
60
55
45
50