Epson SED1530 Series Podręcznik techniczny - Strona 13
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SED1520 Series
PAD
Pad Arrangement
Chip specifications of AL pad package
Chip size: 4.80 7.04 0.400 mm
Pad pitch: 100 100 m
Note: An example of SED1520D
package.
2–4
100
95
90
1
5
10
Y
15
(0, 0)
20
25
30
35
40
4.80 mm
die numbers is given. These numbers are the same as the bump
AA
EPSON
Chip specifications of gold bump package
Chip size:
4.80 7.04 0.525 mm
Bump pitch: 199 m (Min.)
Bump height: 22.5 m (Typ.)
Bump size:
132 111 m ( 20 m) for mushroom
model
116 92 m ( 4 m) for vertical model
85
80
75
70
X
65
60
55
45
50