Toshiba TLP510E 서비스 매뉴얼 - 페이지 23

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Toshiba TLP510E에 대해서도 마찬가지입니다: 기술 교육 매뉴얼 (47 페이지)

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1-1. Replacing Subminiature "CHIP" Parts

1-1-1. Required Tools:

1. Fine tipped, well insulated soldering "pencil", about

30 Watts.

2. Tweezers.

3. Blower type hair dryer.

1-1-2. Soldering Cautions:

1. Do not apply heat for more than 3s.

2. Avoid using a rubbing stroke when soldering.

3. Discard removed chips; do no reuse them.

4. Supplementary cementing is not required.

5. Use care not to scratch or otherwise damage the

chips.

1-1-3. Removal (Resistors, Capacitors, etc.):

1. Melt the solder at one side.

Fig. 1-1-1

2. Grasp the part with tweezers and melt the solder at

the other side.

TWEEZERS

Fig. 1-1-2

3. Remove the part with a twisting motion.

Fig. 1-1-3

1-1-4. Removal (Transistors, Diodes, etc.):

1. Melt the solder of one lead.

TWEEZERS

2. Lift the side of that lead upward.

3. Simultaneously heat solder the two remaining leads

and lift part to remove.

1-1-5. Preheating (Except for semiconductors):

Immediately before installing new resistors or capacitors,

use a blower type hair dryer and preheat the part for

about two min. at approximately 150°C.

1-1-6. Replacement:

1. Presolder the contact points of the circuit pattern.

2. Press the part downward with tweezers and apply the

soldering pencil as indicated in the figure.

TWEEZERS

2-4

Fig. 1-1-4

Fig. 1-1-5

Fig. 1-1-6

Fig. 1-1-7

Fig. 1-1-8