Toshiba TLP510E Instrukcja serwisowa - Strona 23
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Drukuj stronę1-1. Replacing Subminiature "CHIP" Parts
1-1-1. Required Tools:
1. Fine tipped, well insulated soldering "pencil", about
30 Watts.
2. Tweezers.
3. Blower type hair dryer.
1-1-2. Soldering Cautions:
1. Do not apply heat for more than 3s.
2. Avoid using a rubbing stroke when soldering.
3. Discard removed chips; do no reuse them.
4. Supplementary cementing is not required.
5. Use care not to scratch or otherwise damage the
chips.
1-1-3. Removal (Resistors, Capacitors, etc.):
1. Melt the solder at one side.
Fig. 1-1-1
2. Grasp the part with tweezers and melt the solder at
the other side.
TWEEZERS
Fig. 1-1-2
3. Remove the part with a twisting motion.
Fig. 1-1-3
1-1-4. Removal (Transistors, Diodes, etc.):
1. Melt the solder of one lead.
TWEEZERS
2. Lift the side of that lead upward.
3. Simultaneously heat solder the two remaining leads
and lift part to remove.
1-1-5. Preheating (Except for semiconductors):
Immediately before installing new resistors or capacitors,
use a blower type hair dryer and preheat the part for
about two min. at approximately 150°C.
1-1-6. Replacement:
1. Presolder the contact points of the circuit pattern.
2. Press the part downward with tweezers and apply the
soldering pencil as indicated in the figure.
TWEEZERS
2-4
Fig. 1-1-4
Fig. 1-1-5
Fig. 1-1-6
Fig. 1-1-7
Fig. 1-1-8