Toshiba TLP510E Instrukcja serwisowa - Strona 25

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1-5. Inductor Indication

Unit

Tolerance

Type

1-6. Waveform and Voltage Measurement

• Measurement of waveform and voltage at each

section in the color circuits was conducted with

sufficient service color bar signal being received and

reproduced in normal conditions.

• Waveforms and voltage values for the remaining

circuit were measured with a broadcasting signal

normally received, so they may vary slightly accord-

ing to the programs being received. Use them as a

measure for servicing.

• All voltage values except the waveforms are ex-

pressed in DC and measured by a digital voltmeter.

1-7. Chip Part Replacement

(Use spare part with wire leads connected.)

1. Hold a Chip part to be removed with tweezers and

apply heat to the solder at one end of the part with a

soldering iron. (Fig. 1-7-1)

Fig. 1-7-1

2. Apply heat to the solder at the other end of the part

and remove it.

The heating time should be as short as possible so the

excessive heat is not applied to foil patterns and the

PC Board.

........... Η

None

........... µH

........... mH

None

........... ±5%

........... ±0.1%

........... ±0.25%

........... ±0.5%

........... ±1%

........... ±2%

........... ±10%

........... ±20%

........... Peaking

For other, model name is described.

2-6

3. If it is difficult to remove the part, temporarily stop

the desoldering job and wait until temperature of the

part lowers.

Then, repeat steps 1 and 2.

4. Form leads of the replacement part (general part

equivalent to the chip part) as shown in the figures

and solder place. (Fig. 1-7-2)

3 ~ 4 mm

Fig. 1-7-2

5. Mount the replacement part so that it does not touch

any other parts. (Fig. 1-7-3)

RF AGC

QB04

Fig. 1-7-3

10µ

Type

Tolerance

Fig. 1-5-1

3 ~ 4 mm