Dynamic Engineering PCIe 8L XMC X1 User Manual - Page 11

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Construction and Reliability

The PCIe8LXMCX1 is constructed out of 0.062 inch thick high temp RoHS compliant

FR4 material. Cooling cutouts have been designed into the product for improved air

flow to the XMC sites. The components on the PCIe8LXMCX1 are tied into the internal

power planes to spead the dissipated heat out over a larger area. This is an effective

cooling technique in the situation where a large portion of the board has little or no

power dissipation.

A fan option is available for high thermal load XMC's or for a chassis with a lack of air

circulation.

Surface mounted components are used. The connectors are SMT for the XMC bus and

through hole for the IO.

The XMC Module connectors are keyed and shrouded with Gold plated pins on both

plugs and receptacles. They are rated at 1 Amp per pin, 100 insertion cycles minimum.

These connectors make consistent, correct insertion easy and reliable.

The XMC Module is secured against the carrier with the XMC connectors. It is

recommended, for enhanced security against vibration, that the XMC mounting screws

are installed. The screws are supplied with the XMC from the OEM. Dynamic

Engineering has screws, standoffs, blank bezels and other XMC hardware available at a

reasonable cost if your XMC was not shipped with some of the required attachment

hardware or if it has been misplaced.

Thermal Considerations

If the XMC installed has a large heat dissipation; forced air cooling is recommended.

The zero slot Fan option can provide plenty of cooling power should your XMC require

it.

Embedded Solutions

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