Cypress Semiconductor CY7C1223H Specification Sheet - Page 4
Browse online or download pdf Specification Sheet for Computer Hardware Cypress Semiconductor CY7C1223H. Cypress Semiconductor CY7C1223H 17 pages. Cypress 2-mbit (128k x 18) pipelined dcd sync sram specification sheet
Print PagePin Descriptions
Pin
Type
A0, A
, A
Input-
1
Synchronous
BW
Input-
[A:B]
Synchronous
GW
Input-
Synchronous
BWE
Input-
Synchronous
CLK
Input-
Clock
CE
Input-
1
Synchronous
CE
Input-
2
Synchronous
CE
Input-
3
Synchronous
OE
Input-
Asynchronous
ADV
Input-
Synchronous
ADSP
Input-
Synchronous
ADSC
Input-
Synchronous
ZZ
Input-
Asynchronous
DQs
I/O-
Synchronous
DQP
[A:B]
V
Power Supply
DD
V
Ground
SS
V
I/O Power
DDQ
Supply
V
I/O Ground
SSQ
MODE
Input-
Static
NC
Document #: 38-05674 Rev. *B
Address Inputs used to select one of the 128K address locations. Sampled at the rising
edge of the CLK if ADSP or ADSC is active LOW, and CE
A
are fed to the two-bit counter.
[1:0]
Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM.
Sampled on the rising edge of CLK.
Global Write Enable Input, active LOW. When asserted LOW on the rising edge of CLK, a
global write is conducted (ALL bytes are written, regardless of the values on BW
Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal must
be asserted LOW to conduct a byte write.
Clock Input. Used to capture all synchronous inputs to the device. Also used to increment the
burst counter when ADV is asserted LOW, during a burst operation.
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE
and CE
to select/deselect the device. ADSP is ignored if CE
2
3
only when a new external address is loaded.
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction
with CE
and CE
to select/deselect the device. CE
1
3
address is loaded.
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE
and CE
to select/deselect the device. CE
1
2
address is loaded
Output Enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When
LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act
as input data pins. OE is masked during the first clock of a read cycle when emerging from a
deselected state.
Advance Input signal, sampled on the rising edge of CLK, active LOW. When asserted, it
automatically increments the address in a burst cycle.
Address Strobe from Processor, sampled on the rising edge of CLK, active LOW. When
asserted LOW, addresses presented to the device are captured in the address registers. A
are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP
is recognized. ASDP is ignored when CE
Address Strobe from Controller, sampled on the rising edge of CLK, active LOW. When
asserted LOW, addresses presented to the device are captured in the address registers. A
are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP
is recognized.
ZZ "sleep" Input, active HIGH. When asserted HIGH places the device in a non-time-critical
"sleep" condition with data integrity preserved. For normal operation, this pin has to be LOW or
left floating. ZZ pin has an internal pull-down.
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered
by the rising edge of CLK. As outputs, they deliver the data contained in the memory location
specified by the addresses presented during the previous clock rise of the read cycle. The
direction of the pins is controlled by OE. When OE is asserted LOW, the pins behave as outputs.
When HIGH, DQs and DQP
[A:B]
Power supply inputs to the core of the device.
Ground for the core of the device.
Power supply for the I/O circuitry.
Ground for the I/O circuitry.
Selects Burst Order. When tied to GND selects linear burst sequence. When tied to V
floating selects interleaved burst sequence. This is a strap pin and should remain static during
device operation. Mode Pin has an internal pull-up.
No Connects. Not internally connected to the die. 4M, 9M, 18M, 72M, 144M, 288M, 576M, and
1G are address expansion pins and are not internally connected to the die.
Description
, CE
1
is sampled only when a new external
2
is sampled only when a new external
3
is deasserted HIGH.
1
are placed in a tri-state condition.
CY7C1223H
, and CE
are sampled active.
2
3
and BWE).
[A:B]
is HIGH. CE
is sampled
1
1
[1:0]
[1:0]
or left
DD
Page 4 of 16
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