HP 1410-24G-R Başlangıç Kılavuzu - Sayfa 7
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Table 3 Dust concentration limit in the equipment room
Substance
Dust
NOTE:
Dust diameter ≥ 5 μm
The equipment room must also meet strict limits on salts, acids, and sulfides, as shown in
eliminate corrosion and premature aging of components.
Table 4 Harmful gas limits in the equipment room
Gas
SO
2
H
S
2
NH
3
Cl
2
ESD prevention
To prevent electrostatic discharge (ESD), follow these guidelines:
Ground the switch correctly.
•
Take dust-proof measures for the equipment room.
•
Maintain the humidity and temperature at a proper level.
•
•
Always wear an ESD-preventive wrist strap. Make sure the wrist strap makes skin contact and is well
grounded.
NOTE:
The ESD-preventive wrist strap is not provided with the switch. Order it yourself.
EMI
All electromagnetic interference (EMI) sources, from outside or inside of the switch and application
system, adversely affect the switch in the following conduction patterns:
•
Capacitance coupling
Inductance coupling
•
Electromagnetic wave radiation
•
Common impedance (including the grounding system) coupling
•
Cables (power cords, signal cables, and output cables)
•
To prevent EMI:
If the AC power supply system is a TN system, use a single-phase three-wire power receptacle with
•
protection earth (PE) to filter interference from the power grid.
Concentration limit (particles/m³)
≤ 3 × 10
(no visible dust on the tabletop over three days)
4
Maximum concentration (mg/m³)
0.2
0.006
0.05
0.01
4
Table
4, to