Dell EMC VxFlex Ready Node R840 Посібник користувача - Сторінка 29

Переглянути онлайн або завантажити pdf Посібник користувача для Зберігання Dell EMC VxFlex Ready Node R840. Dell EMC VxFlex Ready Node R840 44 сторінки.

Друкувати сторінку

Dell EMC VxFlex Ready Node R840 Посібник користувача

Table 21 Particulate contamination specifications (continued)

Particulate contamination

Conductive dust

Corrosive dust

The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon

corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.

Table 22 Gaseous contamination specifications

Gaseous contamination

Copper Coupon Corrosion

Silver Coupon Corrosion

Note:

Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Specifications

Air must be free of conductive dust, zinc whiskers, or other

conductive particles.

Note:

This condition applies to data center and non-data

center environments.

Air must be free of corrosive dust.

Residual dust present in the air must have a deliquescent

point less than 60% relative humidity.

Note:

This condition applies to data center and non-data

center environments.

Specifications

<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.

<200 Å/month as defined by AHSRAE TC9.9.

Technical specifications

R840xd Owner's Guide