Chrontel CH7511B Manual de diseño

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Chrontel

PCB Layout and Design Guide for CH7511B and CH7512B

1.0

NTRODUCTION

Chrontel's CH7511B/7512B is an eDP/DP receiver that integrates LVDS Transmitter for the notebook/AIO display.

The CH7511B is designed to comply with the Embedded Display Port Specification 1.2 and the CH7512B is

designed to comply with the Display Port Specification 1.1a. The CH7511B/7512B provides support for two main

link lanes with data rate running at either 1.62Gb/s or 2.7Gb/s, and accepts data in 18-bit 6:6:6 or 24-bit 8:8:8 RGB

digital format. During system power-up, setting the power on/off sequence for a particular panel can be achieved

through the CH9904 Boot ROM registers. The CH7511B/7512B has incorporated a brightness control function to

interface with LCD backlight module. Brightness control commands sent through AUX Channel are dynamically

translated by the CH7511B/7512B and converted into the LCD backlight control signals.

The CH7511B/7512B can support 18-bit Single Port, 18-bit Dual Port, 24-bit Single Port and 24-bit Dual Port LVDS

outputs in both OpenLDI and SPWG bit mapping for LVDS application. The CH7511B/7512B supports LVDS

output up to 1920x1200.

This application note focuses only on the basic PCB layout and design guidelines for the CH7511B/7512B eDP/DP

Receiver with LVDS Transmitter. Guidelines in component placement, power supply decoupling, grounding, input

/output signal interface are discussed in this document.

The discussion and figures presented in this document are based on the 68-pin QFN (8x8 mm) package of the

CH7511B/7512B. Please refer to the CH7511B/7512B datasheet for details of the pin assignments.

2.0

OMPONENT

Components associated with the CH7511B/7512B should be placed as close as possible to the respective pins. The

following will describe guidelines on how to connect critical pins, as well as the guidelines for the placement and

layout of components associated with these pins.

2.1

Power Supply Decoupling

The optimal power supply decoupling is accomplished by placing a 0.1μF ceramic capacitor at each of the power

supply pins as shown in Figure 1. These capacitors (C1, C2, C3, C4, C5, C7, C8, C10, C11, and C12) should be

connected as close as possible to their respective power and ground pins using short and wide traces to minimize lead

inductance. Whenever possible, a physical connecting trace should connect the ground pins of the decoupling

capacitors to the CH7511B/7512B ground pins, in addition to ground vias.

2.1.1

Ground Pins

The CH7511B/7512B should be connected to a common ground plane to provide a low impedance return path for the

supply currents. Whenever possible, each of the CH7511B/7512B ground pins should be connected to its respective

decoupling capacitor ground lead directly, and then connected to the ground plane through a ground via. Short and

wide traces should be used to minimize the lead inductance. Refer to Table 1 for the Ground pin assignments.

206-1000-014

Rev. 1.7

LACEMENT AND

2020-07-14

ESIGN

ONSIDERATIONS

AN-B014

Application Note