HP Xw460c - ProLiant - Blade Workstation Genel Bakış - Sayfa 25

Anahtar HP Xw460c - ProLiant - Blade Workstation için çevrimiçi göz atın veya pdf Genel Bakış indirin. HP Xw460c - ProLiant - Blade Workstation 35 sayfaları. Mezzanine card installation instructions for supported hp proliant c-class bladesystem servers
Ayrıca HP Xw460c - ProLiant - Blade Workstation için: Uygulama Kılavuzu (35 sayfalar), Hata Önleme Kılavuzu (12 sayfalar), Teknik Beyaz Kitap (12 sayfalar), Ürün Yazılımı Güncellemesi (9 sayfalar), Kurulum Kılavuzu (2 sayfalar), Sıkça Sorulan Sorular Kılavuzu (14 sayfalar), Kurulum Posteri (9 sayfalar), Kurulum Kılavuzu (33 sayfalar), Yönetim Kılavuzu (28 sayfalar), Donanım Kılavuzu (23 sayfalar), Kullanıcı Kılavuzu (33 sayfalar), Optimizasyon Kılavuzu (13 sayfalar), Sınırlı Garanti (10 sayfalar), Kurulum Talimatları Kılavuzu (10 sayfalar), Kurulum Talimatları Kılavuzu (8 sayfalar), Kurulum Talimatları (4 sayfalar), Kurulum Talimatları (2 sayfalar)

Figure 18. Processor heat sink using fully ducted design (left) versus traditional heat sink in a 1U rack-mount

server (right)

Instant thermal monitoring provides a real-time view of heat, power, and cooling data. The

BladeSystem Onboard Administrator retrieves thermal information from all server blades, storage

blades, and interconnect modules in the enclosure to ensure an optimal balance between cooling,

acoustic levels, and power consumption. The Thermal Logic technology in the BladeSystem Onboard

Administrator keeps fan and system power at the lowest level possible. However, if the thermal load

within the enclosure increases, the Thermal Logic feature instructs the fan controllers to increase fan

speeds to accommodate the additional demand. If high temperature levels occur, the ProLiant

Onboard Administrator (iLO 2) and BladeSystem Onboard Administrator modules provide alerts to

various management tools such as HP Insight Control Environment and HP Systems Insight Manager.

In addition, built-in failsafe procedures shut down devices in the enclosure if temperature levels

exceed specified parameters. This prevents permanent damage to any devices within the enclosure.

HP Thermal Logic includes sophisticated algorithms in each BladeSystem ROM, ProLiant Onboard

Administrator (iLO 2), and BladeSystem Onboard Administrator. In combination, these algorithms

minimize the power and cooling required to maintain the proper HP BladeSystem environment.

Power supplies and enclosure power subsystem

Expecting that power supply technology will advance during the lifecycle of the c7000 enclosure, HP

designed the c7000 power subsystem to be flexible and upgradeable. Customers can choose from

four types of HP BladeSystem c7000 Enclosures to select the one that will work best with their data

center power infrastructure:

Single-phase enclosure that accepts IEC C19-C20 power cords (available worldwide for use with

in-rack power distribution units)

Three-phase enclosure with a pair of US/Japan power cords with NEMA L15-30P power

connectors

Three-phase enclosure with a pair of international power cords with IEC 309, 5-Pin, 16A power

connectors

–48V DC Input Modules using a screw down terminal lug (45DG 4AWG 1/4 2H)

Top view

Side view